Cover of an electronic device having surface ornamentation



The present application is related to co-pending U.S. patent applicationSer. No. 29/419,160, entitled “Cover of an Electronic Device HavingSurface Ornamentation”, by Bin Li. This application has the sameassignee as the present application and has been concurrently filedherewith. The above-identified application is incorporated herein byreference.

FIG. 1 is a perspective view of a cover of an electronic device havingsurface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4in FIG. 2.

In FIGS. 1-3, the evenly segmented broken lines indicate portions of thecover of an electronic device having surface ornamentation that form nopart of the claimed design. In FIGS. 2 and 4, the unevenly segmentedbroken lines indicate the portion of the cover of an electronic devicehaving surface ornamentation that is shown on an enlarged scale in FIG.4. The broken lines form no part of the claimed design.

The ornamental design for a cover of an electronic device having surfaceornamentation, as shown and described.